Integrated Core Power iCP
Photeon Unveils Advanced xPU Power Delivery Solution for Ultra-High Current AI Applications
iCP: Flexibility + Density + Efficiency = The future of AI power delivery!
Dornbirn, Austria – Photeon Technologies GmbH, a leading fabless semiconductor supplier in Europe, proudly introduces its most advanced integrated power solution platform, designed to address the growing power demands of next-generation servers. The new Integrated Core Power (iCP) platform combines a DCDC Converter, Power Management, Telemetry, and Ferrite Inductor into a single, innovative design.
Housed in an all-in-one chip scale package with a footprint of less than 20mm2, the iCP offers exceptional power density without compromising performance. This cutting-edge solution is particularly effective in overcoming system-level server power challenges, especially with advancements in AI technology. The iCP 60A model boasts an impressive efficiency of up to 94%, making it ideal for xPU applications with current demands reaching up to 4,000A.
The iCP 60A features four configurable output rails. When operated in parallel mode, it delivers 60A peak, and in distributed mode (using multiple iCPs), has the capability to deliver full system level current. Each of the four outputs can be independently programmed to power individual xPU nodes with a slew rate of 1A/ns.
In addition to its compact footprint, which saves up to 70-80% of motherboard space by eliminating bulky external inductors, the iCP’s height of just 0.5mm offers unparalleled flexibility in thermal management and heatsinking configurations. Its low-profile package is ideal for vertical power delivery, reducing the current path from iCP to xPU and minimizing losses compared to traditional lateral PCB layouts.
The advanced innovation lies in the iCP’s use of an embedded inductor designed and produced by GlobalFoundries. Unlike some IVR solutions that use “air” inductors, the iCP employs GlobalFoundries’ Silicon-based Ultimate Miniature Magnetic Inductor and Transformer (SUMMIT) process which utilizes a ferrite deposition plus copper winding to produce an embedded inductor with high Q-factor enabling high efficiency power conversion. iCP employes the SUMMIT inductor with GlobalFoundries’ 12LP+ process switched at a frequency of 60MHz, optimizing inductor size while providing the added benefit of EMI filtering thanks to the ferrite material.
Designed to offer power architects a high degree of flexibility, the iCP includes programmable outputs, various parallel modes, and telemetry for active temperature sensing at five points, ensuring reliable power delivery.